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《MICROELECTRONICS RELIABILITY》杂志封面

《MICROELECTRONICS RELIABILITY》中科院JCR分区

  • 2025年3月升级版:
  • 大类小类学科Top综述期刊
    工程技术 3区
    PHYSICS, APPLIED
    物理:应用
    3区
    ENGINEERING, ELECTRICAL & ELECTRONIC
    工程:电子与电气
    4区
    NANOSCIENCE & NANOTECHNOLOGY
    纳米科技
    4区

  • 2023年12月升级版:
  • 大类小类学科Top综述期刊
    工程技术 4区
    ENGINEERING, ELECTRICAL & ELECTRONIC
    工程:电子与电气
    4区
    NANOSCIENCE & NANOTECHNOLOGY
    纳米科技
    4区
    PHYSICS, APPLIED
    物理:应用
    4区

    《MICROELECTRONICS RELIABILITY》期刊简介:

    Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

    Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.

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